Form： 2018/3/5Browse：12810
On the MWC2018, Huawei released the first 3GPP 5G01 commercial standard chip 5G01 (Balong 5G01) and Huawei 5G CPE (Consumer Premise Equipment) to support the worlds mainstream 5G band and theoretically achieve data downl...
Form： 2018/1/17Browse：3791
On the evening of January 16, BOE A announced that it has recently signed the Debt Exemption Agreement with Fuzhou Chengtou BOE Investment Co., Ltd., Fuzhou Urban Construction Investment Group and Fuzhou Municipal People's Government on the "Fuzhou 8.5th Generation New Semiconductor Display Device Production Line Project Investment Framework Agreement" , Exempting companies from using the loans for the project totaling 6.3 billion yuan.
Form： 2018/1/9Browse：4891
Memory module maker Wei yesterday (8) announced last December consolidated revenue of 2.552 billion yuan (NT, the same below), a decrease of 13.3%, an increase of 12.65%, the fourth quarter consolidated revenue of 8.228 billion yuan quarter, quarter Up by 0.84%, the year-on-year single-season high. The cumulative total revenue for the full year last year was 32.225 billion yuan, up 38.8% year-on-year and reaching a new high in 4 years.
Form：Altek 2018/1/8Browse：3838
International Consumer Electronics Show CES exhibition on January 9 will be launched in Las Vegas, Taiwan digital imaging program expert Hua Jingke will be released at the CES show the latest 3D sensing depth chip AL6100, hoping to borrow by The world's largest science and technology exhibition so that the world see Huajing Branch of the technical strength and products.
Form：NXP Semiconductors 2017/9/19Browse：5730
NXP Semiconductors N.V., the world's largest supplier of automotive semiconductor solutions, today announced a new generation of RoadLINK solutions that extend its leadership in the field of vehicle-to-everything communications. The new NXP SAF5400 is the world's first high-performance single-chip DSRC modem with automotive standards. With a unique scalable architecture, industry-leading new security features, and advanced RF complementary metal oxide semiconductor components (RFCMOS) and Software Defined Radio (SDR) technology, OEM manufacturers offer flexible options to District deployment of security V2X and on-site upgrades.
Form：Innodisk 2017/8/29Browse：3751
Innodisk (Innodisk) recently released a full range of DDR4 2666 embedded memory module solutions. Including a variety of specifications and sizes, can support a new generation of Intel Core X extreme performance desktop platform, and Intel Xeon Purley server platform (Xeon Scalable series processors) and other computer systems.
Form：AccelStor 2017/8/24Browse：3710
AccelStor Announces New High Availability and Expandable Full Flash Memory Storage Array The NeoSapphire H710 provides flexible, flexible storage configurations for mission critical applications for enterprise users Capacity can be expanded from 27TB to 221TB.
Form：Global Foundries 2017/8/15Browse：3634
Today announced the 2.5D package solution, demonstrating its capabilities for the high-performance 14nm FinFET FX-14ASIC integrated circuit design system.
Form：Qorvo 2017/8/11Browse：3650
Qorvo, Inc., a provider of innovative RF solutions for the interconnected world, today announced the availability of a new asymmetric Doherty amplifier, the QPD2731, to help customers achieve ultra-high efficiency in designing wireless base station equipment.
Form：Microsemi Corporation 2017/8/9Browse：3779
Microsemi Corporation, a leading provider of differentiated semiconductor technology solutions for power, security, reliability and performance, today announced that its Switchtec PAX network interconnects Gen3 PCIe switching chips to provide high-performance network connectivity , For scalable multi-host systems and Just a bunch of flash (JBOF), and supports single input / output (I / O) virtualization (SR-IOV), NVMe, and multifunction endpoints.
